Universal Array Test Sockets: Cost-Effective Testing Solutions
Versatile BGA test sockets designed for array-based packages with shared ball pitch and variable package size.
RTI's universal array test sockets are engineered to optimize cost of ownership, simplify inventory management, and keep your demanding test schedules on track. Our solutions are sought by OEMs and distributors tasked with testing multiple array-based device footprints that share a common ball spacing (lead pitch) but vary in package size and pin count. Whether you're testing BGA, LGA, or WLCSP, our innovative compression mount test socket technology ensures precise alignment and exceptional electrical performance. Explore our complete range of universal array test socket solutions designed to accommodate DUTs with varying DxE dimensions while maintaining reliability and operator efficiency.
▪ Cost-Effective Testing
Test multiple BGA , LGA, and WLCSP device footprints with the same ball pitch using a single universal array test socket. Avoid the need to purchase device-specific sockets for each new package variation.
▪ Precise Alignment
The floating base architecture combined with replaceable alignment inserts ensures precise device-to-pin alignment, supporting fine pitches down to 0.3mm.
▪ Versatile Compatibility
These compression mount test sockets can be easily moved between application boards. Each socket supports a range of BGA, LGA, and WLCSP devices with the same pitch, up to the maximum drilled pin count.
▪ Simplified Testing Process
The universal array socket design simplifies test setup, allowing engineers to switch between different IC packages without major hardware changes.
Universal Array Test Sockets: Cost-Effective Testing Solutions
Versatile BGA test sockets designed for array-based packages with shared ball pitch and variable package size.
RTI's universal array test sockets are engineered to optimize cost of ownership, simplify inventory management, and keep your demanding test schedules on track. Our solutions are sought by OEMs and distributors tasked with testing multiple array-based device footprints that share a common ball spacing (lead pitch) but vary in package size and pin count. Whether you're testing BGA, LGA, or WLCSP, our innovative compression mount test socket technology ensures precise alignment and exceptional electrical performance. Explore our complete range of universal array test socket solutions designed to accommodate DUTs with varying DxE dimensions while maintaining reliability and operator efficiency.
▪ Cost-Effective Testing
Test multiple BGA , LGA, and WLCSP device footprints with the same ball pitch using a single universal array test socket. Avoid the need to purchase device-specific sockets for each new package variation.
▪ Versatile Compatibility
These compression mount test sockets can be easily moved between application boards. Each socket supports a range of BGA, LGA, and WLCSP devices with the same pitch, up to the maximum drilled pin count.
▪ Precise Alignment
The floating base architecture combined with replaceable alignment inserts ensures precise device-to-pin alignment, supporting fine pitches down to 0.3mm.
▪ Simplified Testing Process
The universal array socket design simplifies test setup, allowing engineers to switch between different IC packages without major hardware changes.
The Concept
RTI's universal BGA & WLCSP test sockets are a cost effective solution when tests need to be performed on multiple package sizes of the same ball pitch.
Available pitches range 0.3mm through 1.27+mm.
(A) Universal Array Test Socket Body is drilled at your desired pitch for the largest array size you anticipate testing. This impacts the ultimate versatility of the socket, as multiple packages of smaller arrays with the same pitch can be tested using the same socket.
(B) Device Specific Alignment Plates are installed to mask over unused pins and align each package to the unchanging Pin A1 position in the upper left corner for easier pin mapping
(C) Screw Down Open/Closed Top or Sapphire Window Lids are designed for each new device that will be tested. Variations in package size and thickness between DUTs mean unique lids are needed for optimal compression.
(D) Optional Universal, Clip-on, Adjustable Lids specific to socket series may be available. These lids allow for more rapid swap-out of packages by removing the need to unscrew the FA lid with each insertion.
Product Details & More
Here, you'll find helpful links, PDF downloads for manuals and brochures, and related blog posts. For further assistance, please contact our customer support team.
Universal Array Pin Map
Test sockets drilled and pinned for the maximum array size can test devices of the same pitch but smaller array using interchangeable alignment plates.
Device specific alignment plates typically justify ball A1 on the device to pin A1 on the test socket. This makes pin mapping between the test socket and test equipment consistent for each new package footprint.
However, the desired position of Ball/Pin A1 on the test socket can be specified by the user as each new alignment plate is designed.
Universal WLCSP Test Sockets
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Universal BGA Test Sockets
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Device-Specific Alignment Plates
Device-specific alignment plates are precision-engineered components used in IC testing to ensure accurate and repeatable positioning of the device under test (DUT) within a test socket or fixture. These plates are tailored to the specific dimensions and features of a particular IC package, making them a critical element in high-precision testing environments.
Alignment plates justify the A1 ball of the DUT to the A1 pin position on the test socket to maintain pinout consistency across devices but can be customized to align to your desired position in the pin array.
Alignment Plates for WLCSP/CSP devices:
- Material: Ultem1000, Cirlex
- Mounting: Pressure Fit, Keyed
- Nominal Thickness: 0.3mm (variable based on DUT thickness)
Alignment Plates for packaged IC devices:
- Material: Aluminum, Ultem
- Mounting: 4-site Screw Down
- Nominal Thickness: 1.27mm (variable based on socket model and DUT thickness)
Lid Options
Universal array test sockets can utilize any of RTI's standard lid designs but are typically used with low-profile screw-down and clip-on adjustable variations. For applications requiring visual access, lids equipped with Quartz or Sapphire glass windows are available and can be universal, provided all DUTs share the same nominal thickness.
However, devices with varying package thicknesses necessitate the use of device-specific lids to ensure proper fit and functionality. To facilitate rapid swapping of DUTs without the need for hand-screwing, clip-on adjustable lids serve as a versatile and universal replacement, streamlining the testing process and enhancing operational efficiency. Here are our most popular options:
Quartz or Sapphire Window Lids (WLCSP)
- Features: 100% visibility of WLCSP DUT surface. Applies even compression force, contacting DUT and alignment plate to distribute pressure evenly
- Mounting: 2-site or 4-site Screw Down, Removable
- Utility: Optical Inspection and Scanning (EMMI)
Open-Top Low-Profile (BGA)
- Features: Contacts perimeter of decapsulated devices for physical access to DIE and bond wires. Very low profile for use with tools that have limited clearance surrounding the socket
- Mounting: 2-site or 4-site Screw Down, Removable
- Utility: EMMI, MicroProbing, Forced Air Thermal, Optical Calibration, laser induced fault injection and Laser Voltage Probing
Dual-Latch Clip-On Removable
- Features: Dedicated and Universal Designs. Rapid swapping between DUTs
- Mounting: Dual-latch clip-on, Removable
- Utility: Hand test, prototyping, engineering, and optional openings for some designs. Universal clip-on removable lids used in conjunction with open-top low profile remove the need for screws by applying compression force between lid(s) and DUT
Dual-Hinge High Force Latching
- Features: Pivoting X/Y gimballed pressure plate for even, near-vertical force on DUT. Ease of use with high pin count and high insertion force test sockets.
- Mounting: 4-site Screw Down, Removable
- Utility: Mid-High volume hand test, prototyping, engineering, characterization, and ATE. Leverage provides high force with minimal operator effort (press of a single finger)
RTI's Universal Array, BGA & WLCSP Test Socket Gallery
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Download Info Sheets Here
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